Thermal Expansion of Anti-Perovskite Mn3Zn1-xSnxN Compounds

Xue Hua Yan; Jia Qi Liu; Zhu Yuan Hua; Bing Yun Li; Xiao Nong Cheng

doi:10.4028/www.scientific.net/KEM.512-515.890

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 512-515Thermal Expansion of Anti-Perovskite Mn3Zn1-xSnxN...

Thermal Expansion of Anti-Perovskite Mn₃Zn_1-xSn_xN Compounds

Abstract:

The anti-perovskite structured Mn₃XN(X=Cu,Al,Ag,Zn,Ga,Sn,In) have wide perspective and practicability with unique advantages compared with other materials as a new negative thermal expansion (NTE) material. Because of its simple preparation and unique properties of NTE, this kind of compounds aroused scientists’ attention. The metallic nitrides Mn₃Zn_1-xSn_xN (x=0.1, 0.2, 0.3, 0.4, 0.5) were prepared by solid-state sintering. The anti-perovskite compound Mn₃Zn_1-xSn_xN has a cubic crystal structure with space group Pm3m. It shows that Zn element is partial replaced by Sn element. The Sn doping in Mn₃Zn_1-xSn_xN compound can cause the thermal expansion behavior of the compound to change between positive and negative by analyzing the curve of thermal expansivity with the temperature. Mn₃Zn_0.7Sn_0.3N shows a very strong NTE. Its negative thermal expansion coefficients were -4.39×10^-4/K from 345.4 °C to 476.2 °C. In addition, the variation of the thermal expansion curve for Mn₃Zn_0.8Sn_0.2N is almost negligible with the increasing of temperature to 600 °C, exhibiting nearly zero thermal expansion behavior. Therefore, the thermal expansion of Mn₃Zn_1-xSn_xN could be tuned via different contents of Sn in Mn₃ZnN.

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Key Engineering Materials (Volumes 512-515)

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890-893

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https://doi.org/10.4028/www.scientific.net/KEM.512-515.890

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June 2012

Authors:

Xue Hua Yan, Jia Qi Liu, Zhu Yuan Hua, Bing Yun Li, Xiao Nong Cheng

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Anti-Perovskite Manganese Nitrides, Doped, Sn, Thermal Expansion

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