The Effect of SiC Surface Treatment on the Interface Bonding Behavior of SiC/Cu Composite Particles

Abstract:

The SiC/Cu composite is one of the "structural-functional" materials. It shows good mechanical properties and very high thermal, high electrical conductivity etc. But the co-dispersion, wetting and bonding between SiC and Cu interface are of practical importance in the preparation of SiC/Cu composites. In this work, surface treatment techniques such as high-temperature oxidation, acid dipping and alkaline wash were adopted separately on silicon carbide particles, in order to improve the wettability and physical and chemical compatibility between silicon carbide and copper, then we used the replacement reaction method and decomposition-reduction reaction method to generate Cu coating on the surface of silicon carbide. The results shown that, the surface of silicon carbide particle which treated by alkaline wash was cleaner and more rough than that only treated by high-temperture oxidation, moreover, the specific surface of the particle was increased, which resulted in a compact layer of Cu coating. for the same silicon carbide particles, the effect of the Cu coating prepared by decomposition reaction method was better than that by reduction reaction method.

• Periodical: Key Engineering Materials (Volumes 512-515)
• Pages: 951-954
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.512-515.951
• Online since: June 2012
• Authors: Bing Bing Fan, Huan Huan Guo, Jian Li, Hai Long Wang, Ke Bao, Rui Zhang
• Keywords: SiC/Cu Composite Particles, Surface Treatment

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