Experimental and Numerical Analysis of Polymer Deformation in Thermal Nanoimprint Lithography

Ki Hoon Shin; Hee Su Park; Hong Seok Kim

doi:10.4028/www.scientific.net/KEM.516.269

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 516Experimental and Numerical Analysis of Polymer...

Experimental and Numerical Analysis of Polymer Deformation in Thermal Nanoimprint Lithography

Abstract:

Nanoimprint lithography has been widely used in various applications as a promising micro/nanofabrication tool. In the thermal nanoimprint process, optimization of important process parameters such as temperature, pressure, and pressure holding time is greatly needed to successfully imprint micro-and nanoscale patterns in a resist material. In this study, both experimentation and numerical simulation were performed to extend the understanding of the behaviour of polymer materials and to optimize process condition effectively during the thermal imprint process. The effects of the process conditions on the polymer deformation are discussed to achieve a rapid and high throughput thermal imprint process.

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Periodical:

Key Engineering Materials (Volume 516)

Pages:

269-274

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.516.269

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Online since:

June 2012

Authors:

Ki Hoon Shin, Hee Su Park, Hong Seok Kim

Keywords:

Finite Element Analysis (FEA), Nanoimprint, PMMA, Polymer, Viscoelastic

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