A Microfluidic Chip Microwave Bonding Method Based on the PMMA

Xiao Wei Liu; Xiao Wei Han; He Zhang; Xi Yun Jiang; Lin Zhao

doi:10.4028/www.scientific.net/KEM.562-565.561

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 562-565A Microfluidic Chip Microwave Bonding Method Based...

A Microfluidic Chip Microwave Bonding Method Based on the PMMA

Abstract:

A new bonding technique mainly for PMMA microfluidic chips is presented in this paper. In this technique, polymer microfluidic microchannels were bonded by microwave radiation. Its strength and time can be controlled accurately in watt and second level. There are so many techniques for mass-production of polymer microfluidic chip, such as heat bonding, ultrasonic bonding. However, we may find different kinds of shortages when we use these techniques. In this paper, the experiment result shows that microwave radiation’s strength and time have effects on microfluidic chip`s bonding strength. The microwave absorbing coating can also have a certain degree influence on microfluidic chip`s bonding strength.

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Periodical:

Key Engineering Materials (Volumes 562-565)

Pages:

561-565

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.562-565.561

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Online since:

July 2013

Authors:

Xiao Wei Liu, Xiao Wei Han, He Zhang, Xi Yun Jiang, Lin Zhao

Keywords:

Microfluidic Chip, Microwave Bonding Technique, Polymer

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References

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