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Preparation of Composite Spherical Alumina Nanoparticles and Study on their CMP Performance

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Abstract:

The properties of abrasives have great influences on the surface qualities of glass substrate, hard disk, etc[1], during the chemical mechanical planarization (CMP) process. α-Al2O3 particles, as one of the most widely used abrasives in CMP slurries, often cause great surface defects because of its high hardness and unfeasible control of agglomeration during the synthesizing process [2,3]. In this paper, spherical nanocomposite alumina powders with particle sizes of 10-50 nm were prepared, via a homogeneous precipitation method. The structures and surface morphologies of the alumina nanopowders were characterized by means of X-ray diffraction (XRD), scanning electron microscope (SEM) and atomic force microscope (AFM). The results showed that the nanopowders composed of both alpha and theta phase alumina, which had a small particle size and narrow size distributions. The CMP investigations performed on glass substrate showed that the nanocomposite alumina abrasives exhibited a better surface planarization performance than the pure single alpha phase Al2O3 nanopowders, with lower surface roughnesses and less scratches after CMP process. The results indicated that the current processing for the synthesis of nanocomposite Al2O3 powders were of great potentials for practical applications of Al2O3 based abrasives.

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Periodical:

Key Engineering Materials (Volumes 562-565)

Pages:

869-873

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.562-565.869

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Online since:

July 2013

Authors:

Li Tian, Zong Tao Zhang, Jing Zhang, Qiu Xia Sun, Xiao Lin Jia

Keywords:

CMP, Composite Alumina, Nanostructure, Planarization

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] Jun Wang, Andrew G,Haerle.Chemical mechanical planarization of copper using transition alumina nanoparticles,Thin Solid Films.516 (2008) 7648–7652.

DOI: 10.1016/j.tsf.2008.06.029

Google Scholar

[2] Hong Lei , Pengzhen Zhang.Preparation of alumina/silica core-shell abrasives and their CMP behavior Applied Surface Science.253 (2007) 8754–8761.

DOI: 10.1016/j.apsusc.2007.04.079

Google Scholar

[3] Lei Hong , Bu Naijing, Zhang Zefang,et al. Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composite Abrasive.Journal of Mechanical Engineering 123(2010)276-281.

DOI: 10.3901/cjme.2010.03.276

Google Scholar

[4] MoonKi Jeong, SeungJae Jo, HyunSeop Lee,et al.Chemical Mechanical Planarization of Copper Bumps on Printed Circuit Board.International Journal of Precision Engineering and Manufacturing .12(2011). 149-152.

DOI: 10.1007/s12541-011-0019-6

Google Scholar

[5] Heyvaert I,van Hove M,Witvrouw A.Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminum metallisations.50(2000) 291–299.

DOI: 10.1016/s0167-9317(99)00295-6

Google Scholar

[6] Min-Ho Choi, Nam-Hoon Kim, Jong-Heun Lim, et al.Agglomeration characteristic of particles in alumina slurry by addition of chemicals and milling process for Cu CMP.Materials Science and Engineering B 118 (2005) 306–309.

DOI: 10.1016/j.mseb.2004.12.059

Google Scholar

[7] T. Laursen, M. Grief,Characterization and optimization of copper chemical mechanical planarization.J. Electron. Mater. 31 (2002) 1059.

Google Scholar

[8] Lei Hong, Lu Haishen, et al.Study on Polishing Properties of Alumina Composite Abrasive, Lubrication Engineering.32(2007).

Google Scholar

[9] Y.G. Wang, L.C. Zhang, A. Biddut.Chemical effect on the material removal rate in the CMP of silicon wafers.Wear270 (2011) 312–316.

DOI: 10.1016/j.wear.2010.11.006

Google Scholar

[10] Hong-Shi Kuo, Wen-Ta Tsai.Effects of alumina and hydrogen peroxide on the chemical-mechanical polishing of aluminum in phosphoric acid base slurry.Materials Chemistry and Physics 69 (2001) 53–61.

DOI: 10.1016/s0254-0584(00)00299-6

Google Scholar

[11] Myung-Geun Song, Jin-ho Lee, Yoon-Gyu Lee, Ja-ho Koo.Stabilization of gamma alumina slurry for chemical–mechanical polishing of copper.Journal of Colloid and Interface Science 300 (2006) 603–611.

DOI: 10.1016/j.jcis.2006.04.046

Google Scholar

[12] Zefang Zhang, Hong Lei.Preparation of a -alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate.Microelectronic Engineering 85 (2008) 714–720.

DOI: 10.1016/j.mee.2008.01.001

Google Scholar

[13] Yong-Jin Seo , Sang-Yong Kim , Woo-Sun Lee Advantages of point of use (POU) slurry filter and high spray method for reduction of CMP process defects. Microelectron. Eng. 70(2003) 1-6.

DOI: 10.1016/s0167-9317(03)00278-8

Google Scholar

[14] A. Jindal, S. Hegde, S.V. Babu, Electrochem. Solid StateLett. 5 (2002) G48.

Google Scholar

[15] Yong-Jin Seo, Woo-Sun Lee, Pochi Yeh.Improvements of oxide-chemical mechanical polishing performance s and aging effect of alumina and silica mixed abrasive slurries.Microelectronic Engineering 75 (2004) 361–366.

DOI: 10.1016/j.mee.2004.07.062

Google Scholar