Mixing Optimization of Sn-Cu-Si₃N₄ via Powder Metallurgy Route for Composite Solder Fabrication

Abstract:

The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, mixed and blended in a mechanical alloying machine. The speed of rotation for the jar was kept constant while the time of mixing was varied. Si₃N₄ were added to the Sn-0.7Cu solder as reinforcement. Upon completion of mixing process, the mixed powders were later compacted into a thin disc. The compacted samples were then sintered in a horizontal tube furnace. Microstructural examinations by using SEM were conducted in order to analyze the distribution of Cu and Si₃N₄ particles. With the assistance of ImageJ software, average particle distributions were calculated. Results showed that the best particle distributions were achieved when the mixed powder were blended for 6 hours.

• Periodical: Key Engineering Materials (Volumes 594-595)
• Pages: 765-769
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.594-595.765
• Online since: December 2013
• Authors: Muhammad Hafiz Zan Hazizi, Mohd Arif Anuar Mohd Salleh, Zainal Ariffin Ahmad
• Keywords: Composite, Lead-Free Solder, Powder metallurgy, Silicon Nitride, Sn-0.7Cu

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