Study on Fabrication Process of SU8 Photoresist Microstructures and Evaluation of Stress Gradient

Hua Rong; Jian Wei; Xi Chen

doi:10.4028/www.scientific.net/KEM.609-610.740

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 609-610Study on Fabrication Process of SU8 Photoresist...

Study on Fabrication Process of SU8 Photoresist Microstructures and Evaluation of Stress Gradient

Abstract:

A fabrication process to manufacture SU8 photoresist microstructures is presented in which BP212 positive photoresist was used as sacrifice layer and SU8 was used as structure layer. No crack has been observed in the obtained microstructures. The relation between PEB temperature and stress gradient in SU8 film has been studied by measuring radii of released SU8 cantilevers made at different PEB temperatures.

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Periodical:

Key Engineering Materials (Volumes 609-610)

Pages:

740-744

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.609-610.740

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Online since:

April 2014

Authors:

Hua Rong*, Jian Wei, Xi Chen

Keywords:

Sacrifice Layer Technology, Stress Gradient, SU-8 MEMS Microstructure

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* - Corresponding Author

References

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