[1]
Li X P, He T, Rahman M, Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer, Wear. 259 (2005) 1207-1214.
DOI: 10.1016/j.wear.2004.12.020
Google Scholar
[2]
LIANG Ying-chun, GUO Yong-bo, CHEN Ming-jun, New progress of research in diamond tool wear of nanometric machining, Tribology. 03(2008) 282-288.
Google Scholar
[3]
ZONG Wen-jun, SUN Tao, LI Dan, et al, Tool Wear mechanism involved in diamond turning of single crystal silicon, Nanotechnology and Precision Engineering. 7(2009) 270-274.
Google Scholar
[4]
ZHAO Qing-liang, CHEN Ming-jun, LIANG Ying-chun, et al, Wear of diamond cutting tool in ultra-precision single point turning, Tribology. 22(2002) 321-326.
Google Scholar
[5]
Yan J, Syoji K, Tamaki J, Some observations on the wear of diamond tools in ultra-precision cutting of single-crystal silicon, Wear. 255(2003) 1380-1387.
DOI: 10.1016/s0043-1648(03)00076-0
Google Scholar
[6]
Wang Z G, Liang Y C, Chen M J, et al. Analysis about diamond tool wear in nanometric cutting of single crystal silicon using molecular dynamics method, SPIE Proceedings. 7655 (2010).
Google Scholar
[7]
Tersoff J, New empirical model for the structural properties of silicon, Physical Review Letters. 56(1986) 632-635.
DOI: 10.1103/physrevlett.56.632
Google Scholar
[8]
Tersoff J, Modeling solid-state chemistry: interatomic potentials for multi component system. Physics Review. B39 (1989) 5566-5568.
DOI: 10.1103/physrevb.39.5566
Google Scholar
[9]
Verlet L, A New Algrorisum of MDS, Phys. 159 (1967) 98-110.
Google Scholar
[10]
Mackawa. M, Iton, A. friction and tool wear in nano-scale machining-a molecular dynamics approach, Wear. 188 (1995) 115-122.
DOI: 10.1016/0043-1648(95)06633-0
Google Scholar
[11]
CHEN Zheng-long, XUE Wei-ren, TANG Li-da, The theory and practice of molecular simulation, Beijing, (2007).
Google Scholar
[12]
ZANG Jian-bing. Study of some physical concepts and influence factors about the thermal stability of diamond, Diamond & Abrasives Engineering. 5(1997) 5-7.
Google Scholar
[13]
GUO Zhi-meng, SONG Yue-qing, et al. Superhard materials and tools, Beijing, (1996).
Google Scholar
[14]
Shimada S, Molecular Dynamics Analysis of Nanometric Cutting Process[J], Journal of the Japan Society of Precision Engineering. 29(1995) 283∼286.
Google Scholar
[15]
Wang Qin-sheng, Superhard material manufacturing, Beijing, (2002).
Google Scholar