Effects of C/Si Ratio on the Structure of β-SiC Film by Halide CVD

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Thick (over 1 mm) β-SiC films were deposited at a deposition temperature of 1823 K and a total pressure of 4 kPa by halide CVD using SiCl4 and CH4 as precursors, and H2 as carrier gas. The maximum deposition rate was 1125 μm h−1. The SiC films showed strong (220) preferred orientation. The grain size increased from 20 to 100 μm with increasing C/Si ratio.

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227-231

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June 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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