Etching Morphology of Vitreous Silicon Dioxide in HF-Based Solution

Zhu Feng Shao; Shu Zhong Tian; Hui Wang; Zai Kui Xiang

doi:10.4028/www.scientific.net/KEM.633.107

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Etching Morphology of Vitreous Silicon Dioxide in HF-Based Solution
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 633Etching Morphology of Vitreous Silicon Dioxide in...

Etching Morphology of Vitreous Silicon Dioxide in HF-Based Solution

Abstract:

The surface morphology of quartz glass etched in HF acid is influenced by many factors, such as the quality of polishing, types of the quartz glasses, metal ion in HF acid, etc. This paper conducted an analysis on these factors and tried to make improvements. Meanwhile, this experiment approved of the model of both destructive layer and the varying of closed micro-cracks in the process of etching. Besides, the changing law of both ditch-like and pit-like flaws was investigated in this experiment, and conclusions could be drawn as follows: at the concave curvature, the bigger the radius of curvature is, the faster the etching will be; The etching rate with protruding curvature is higher than that of concave curvature; The etching rate with concave curvature is lower than that on the plane surface.

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Periodical:

Key Engineering Materials (Volume 633)

Pages:

107-111

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.633.107

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Online since:

November 2014

Authors:

Zhu Feng Shao*, Shu Zhong Tian, Hui Wang, Zai Kui Xiang

Keywords:

Etching, Hydrofluoric Acid, Quartz Glass

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* - Corresponding Author

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