A Nano-Cantilever Bending Method for Interface Cracking in Nanoscale Materials

Abstract:

A nanocantilever bending method is developed to investigate the interface cracking in multilayered nanoscale materials basing on the technology of the focused ion beam (FIB) and the transmission electron microscopy (TEM). With FIB, a nanocantilever specimen consisting of 20-nm-thick copper (Cu) layer and 500-nm-thick silicon nitride (SiN) layer on a silicon (Si) substrate is fabricated from a macroscale multi-layered material (Si/Cu/SiN) with the proposed method. By using a minute loading apparatus, the loading experiment is conducted in TEM, and the crack initiation at the edge of Cu/Si interface in different specimens is in situ observed. The critical stress fields at crack initiation are analyzed with the finite element method, and both normal and shear stresses concentrate at the region of 100 nm from the interface edge in all specimens. In addition, the normal stress is much larger than the shear one. A close observation on stress fields shows that the normal stress field at the area 20 nm–30 nm away from interface edge produces the local criterion for crack initiation at the edge of Cu/Si interface in nanoscale components.

• Periodical: Key Engineering Materials (Volumes 645-646)
• Pages: 912-919
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.645-646.912
• Online since: May 2015
• Authors: Xiao Yuan Wang, Ya Bin Yan*
• Keywords: Cantilever Bending Method, Cracking, Delamination, Interface, Nanoscale, Thin Film

References

[1] D.B. Bogy, Two edge-bonded elastic wedges of different materials and wedge angles under surface tractions, J. Appl. Mech. 38 (1971) 377–386.

DOI: 10.1115/1.3408786

[2] P.E.W. Labossiere, M.L. Dunn, Fracture initiation at three-dimensional bimaterial interface corners, J. Mech. Phys. Solids 49 (2001) 609–634.

DOI: 10.1016/s0022-5096(00)00043-0

[3] E.D. Reedy, T.R. Guess, Comparison of butt tensile strength data with interface corner stress intensity factor prediction, Int. J. Solids Strcut. 30 (1993) 2929–2936.

DOI: 10.1016/0020-7683(93)90204-k

[4] X.J. Fan, H.B. Wang, T.B. Lim, Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading, IEEE Trans. Compon. Pack. Technol. 24 (2001) 84–91.

DOI: 10.1109/6144.910806

[5] T. Kitamura, T. Shibutani, T. Ueno, Crack initiation at free edge of interface between thin films in advanced LSI, Engng. Fract. Mech. 69 (2002) 1289–1299.

DOI: 10.1016/s0013-7944(02)00009-7

[6] T. Kitamura, H. Hirakata, T. Itsuji, Effect of residual stress on delamination from interface edge between nano-films, Engng. Fract. Mech. 70 (2003) 2089–2101.

DOI: 10.1016/s0013-7944(02)00254-0

[7] T.L. Becker Jr., J.M. McNancy, R.M. Cannon, R.O. Ritchie, Limitations on the use of the mixed-mode delaminating beam test specimen: effect of the size of the region of K-dominance, Mech. Matter. 25 (1997) 291–308.

DOI: 10.1016/s0167-6636(97)00010-0

[8] S. Zhang, D. Sun, Y.Q. Fu, H.J. Du, Toughness measurement of thin films: a critical review, Surf. Coat. Technol. 198 (2005) 74―84.

[9] A.A. Volinsky, N.R. Moody, W.W. Gerberich, Interfacial toughness measurements for thin films on substrates, Acta Mater. 50 (2002) 441―466.

DOI: 10.1016/s1359-6454(01)00354-8

[10] M.P.K. Turunen, P. Marjamaki, M. Paajanen, J. Lahtinen, J.K. Kivilahti, Pull-off test in the assessment of adhesion at printed wiring board metallization/epoxy interface. Microelectron. Reliab. 44 (2004) 993―1007.

DOI: 10.1016/j.microrel.2004.01.001

[11] Y.G. Wei, J.W. Hutchinson, Interface strength, work of adhesion and plasticity in the peel test, Int. J. of Fract. 93 (1998) 315 – 333.

DOI: 10.1007/978-94-017-2854-6_16

[12] L.H. Xiao, X.P. Su, J.H. Wang, Y.C. Zhou, A novel blister test to evaluate the interface strength between nickel coating and low carbon steel substrate, Mat. Sci. Engng. A-Struct. 501 (2009) 235―241.

DOI: 10.1016/j.msea.2008.09.077

[13] P.A. Steinmann, Y. Tardy, H.E. Hintermann, Adhesion testing by the scratch test method: The influence of intrinsic and extrinsic parameters on the critical load, Thin Solid Films 154 (1987) 333―349.

DOI: 10.1016/0040-6090(87)90377-4

[14] M.Y. Lu, H.T. Xie, H. Huang, Characterisation of interfacial adhesion of thin film/substrate systems using indentation-induced delamination: A focused review, Key Engng. Mater. 533 (2012) 201―222.

DOI: 10.4028/www.scientific.net/kem.533.201

[15] F. Shang, T. Kitamura, H. Hirakata, I. Kanno, H. Kotera, K. Terada, Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate, Int. J. Solids Struct. 42 (2005) 1729―1741.

DOI: 10.1016/j.ijsolstr.2004.08.004

[16] R. Dingreville, J. Qu, M. Cherkaoui, Surface free energy and its effect on the elastic behavior of nano-sized particles, wires and films, J. Mech. Phys. Solids 53 (2005) 1827–1854.

DOI: 10.1016/j.jmps.2005.02.012

[17] W.D. Nix, Mechanical properties of thin films, Metall. Mater. Trans. 20 (1989) 2217–2245.

[18] K.S. Lee, S. Wuttiphan, X.Z. Hu, S.K. Lee, B.R. Lawn, Contact-induced transverse fractures in brittle layers on soft substrates: a study on silicon nitride bilayers, J. Am. Ceram. Soc. 81 (1998) 571–580.

DOI: 10.1111/j.1151-2916.1998.tb02376.x

[19] T. Sumigawa, T. Shishido, T. Murakami, T. Iwasaki, T. Kitamura, Evaluation on plastic deformation property of copper nano-film by nano-scale cantilever specimen, Thin solid films 518 (2010) 6040–6047.

DOI: 10.1016/j.tsf.2010.06.039