Process Optimization of Lapping Sapphire Substrate with Fixed Diamond Abrasive Pad

Abstract:

The production cost of the sapphire substrate was restricted by the efficiency of processing and the surface quality. A proposed level orthogonal experiment was conducted to reveal the effect of workbench speed, lapping pressure, the Concentration of triethanolamine and abrasive pad types on the material removal rate and surface roughness and morphology of sapphire substrate when lapped with a diamond fixed-abrasive pad. The results showed that the average material removal rate of sapphire is about 24μm/min, and the surface roughness Ra achieves 0.36μm when the 200/230 mesh diamond fixed-abrasive pad was used. The material removal rate and the surface roughness as the optimization goal, the optimal lapping parameters were as follows: the lapping pad with raised, lapping pressure 0.075MPa, workbench speed 120rpm and the Concentration of triethanolamine 1%. Under these optimal machining parameters, the material removal rate reached 42μm /min and the surface roughness Ra reached 0.37μm.

• Periodical: Key Engineering Materials (Volume 693)
• Pages: 1090-1097
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.693.1090
• Online since: May 2016
• Authors: Jian Bin Wang*, Zhen Li, Hong Gao, Da Shu, Ping Xiao
• Keywords: Fixed Diamond Abrasive, Lapping, Material Removal Rate, Sapphire, Surface Roughness

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