Development of Evaluation Method that Takes into Account the Effect of the Fine Structure of Adhesive Interface for Delamination Strength of the Packaging Resin

Abstract:

This paper describes a new evaluation method of resin delamination strength at the adhesive interface. Power module consists of different materials. Difference of thermal expansion between the dissimilar materials causes the delamination at their interface. The new pudding-cup test method has been used to evaluate the delamination stress, where singular stress or stress intensity factors are used to evaluate the delamination strength. But it is difficult to consider the effect of micro interface structure or bonded compound. In this study, an interface structure was considered to analyze the delamination deformation at the resin interface to develop a new approach to evaluate the delamination behavior. However, it was difficult to recreate the details in the analytical model. In this study, a method to simplify the interface structure as a simple interface layer was proposed. Deformation value of the interface structure is evaluated in this study. As a result, it was confirmed that the analytical method to simplify the interface structure can be used to simulate the delamination behavior. Deformation absolute value in the delamination points was confirmed to agree with various load points in same material. These results suggested the deformation of the interface layer can be used as a simple parameter to estimate the delamination of a resin structure boundary.

• Periodical: Key Engineering Materials (Volume 741)
• Pages: 19-24
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.741.19
• Online since: June 2017
• Authors: Yukichi Furuyama*, Okihisa Honda, Qiang Yu
• Keywords: Adhesion Reliability, Evaluation, Fine Structure, Resin

References

[1] T. MIYOSHI, M. SHIRATORI, J. ODA, Daigakukiso Zairyourikigaku, Zikkyou Shuppan, Japan, 2006, pp.31-32.

[2] Technical Information Institute Co., Jushi To Kinzoku No Settyaku Setsugou Gijutsu, Nihoninsatsu, Japan, 2013, pp.3-35.

[3] D. CHEN, K. USHIJIMA, Elastic-Plastic Stress Singularity Near a Bonded Interface, Nihonkikaigakkaironbunshuu, Japan 1999, pp.119-126.

[4] T. HATTORI, S. SAKATA, T. HATSUDA, G. MURAKAMI, A Stress Singularity Parameters Approach for Evaluating Adhesive Strength, Nihonkikaigakkaironbunshuu, Japan, 1988, pp.597-602.

[5] Y. MURAKAMI, M. ISIDA, Analysis of An Arbitrarily Shaped Surface Crack and Stress Field at Crack Front near Surface, Nihonkikaigakkaironbunshuu, Japan, 1985, pp.1050-1056.

DOI: 10.1299/kikaia.51.1050

[6] K. MIYAZAKI, M. MOCHIZUKI, Effects of Residual Stress Distribution and Geometry of Components on Stress Intensity Fact or and Crack Growth Behavior of Surface Crack: Evaluation of SCC Growth under Residual Stress Field (Report 2), Quarterly journal of the Japan Welding Society, Japan, 2006, pp.78-86.

DOI: 10.2207/qjjws.24.78

[7] K. HIROTA, MobilPowerElectronikusunyuumon No. 1, Nikkeierekutoronikusu, Japan, 2007, pp.138-145.

[8] T. SAKAKIBARA, Zidoushaelectronikusudoukoto zissougizyutuhenokitai, Dai79kai microsetugouiinkai, Japan, 2005, pp.25-30.

[9] M, ISHIGO, Y. NISHIBE, Y. YAMADA, T. SUGIYAMA, Zidoushayoukoupawermitsudoinbata, Denshizyouhoutsuushingakkaigizyutsukenkyuuhoukoku, Japan, 2007, pp.17-22.

[10] H. OHAASHI, Powerelectronicssouron, Ouyoubutsuri, Japan, 2004, pp.1571-1574.