Influence of Sintering Conditions on Mechanical Properties of Ag-Nano Sintered Material

Shota Okuno; Qiang Yu; Yusuke Nakata

doi:10.4028/www.scientific.net/KEM.741.7

Paper Titles

Mechanical Properties of Functionally Graded Porous Aluminum Consisting of Pure Aluminum and Al-Mg-Si Aluminum Alloy
p.1

Influence of Sintering Conditions on Mechanical Properties of Ag-Nano Sintered Material
p.7

Crack Resistance Characterization in TiAl Intermetallics with Enhanced Toughness
p.13

Development of Evaluation Method that Takes into Account the Effect of the Fine Structure of Adhesive Interface for Delamination Strength of the Packaging Resin
p.19

Fracture Toughness of Massively Transformed and Subsequently Heat Treated TiAl Intermetallic Compound
p.25

Solid-State Diffusion Bonding of Titanium by Using Metal Salt Coated Aluminum Sheet
p.31

Mechanical Stability and Deformation-Induced Transformation of Retained Austenite in TRIP Steels at Low Temperatures
p.36

Influence of Chloride for SCC Susceptibility on 15Cr Stainless Steel at High Temperatures under CO₂ Environment
p.42

HomeKey Engineering MaterialsKey Engineering Materials Vol. 741Influence of Sintering Conditions on Mechanical...

Influence of Sintering Conditions on Mechanical Properties of Ag-Nano Sintered Material

Abstract:

Recently, sintering joint using Ag-nanohas been attracting attention as a new joint method to replace the solder. However, the joint layer would contain a lot of voids after sintering processes. Since the voids affect mechanical property, the proper sintering conditions have to be selected in order to reduce these voids. In this research, the authors focus on the effect of pressure conditions at sintering process. Then, by creating FEM models including voids from cross section image of the joint layer and carrying out tensile analysis, the mechanical property of the joint layer has been acquired. Using this approach, the influence of pressure conditions on the mechanical properties is revealed.

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Periodical:

Key Engineering Materials (Volume 741)

Pages:

7-12

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.741.7

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Online since:

June 2017

Authors:

Shota Okuno*, Qiang Yu, Yusuke Nakata

Keywords:

Ag-Nano, Power Device, SiC, Sinter Bonding

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* - Corresponding Author

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