Electron-Ion-Plasma Doping of Aluminum Surface with Copper and Titanium - A Comparative Analysis of the Formed Structure and Properties

Abstract:

Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron-nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.

• Periodical: Key Engineering Materials (Volume 781)
• Pages: 76-81
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.781.76
• Online since: September 2018
• Authors: Yurii F. Ivanov*, Аnatoliy A. Klopotov, Aleksandr I. Potekaev, Olga V. Krysina, Pavel Moskvin, Elizaveta A. Petrikova, Olga V. Ivanova, Nikolaii Tsvetkov, Oleg S. Tolkachev
• Keywords: Commercially Pure Aluminum, Copper Film, Film-Substrate System, Low-Energy High-Current Electron Beams, Properties, Structure, Titanium

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