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HomeKey Engineering MaterialsKey Engineering Materials Vol. 822Aspect-Independent Siliconglass Etching by Bosch...

Aspect-Independent Siliconglass Etching by Bosch Method

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Abstract:

The purpose of this work was to study and carry out glass etching of monocrystalline silicon using the Bosch method, acquaintance with the conditions of aspect-independent etching. The Bosch process was conducted using sulfur hexafluorideSF₆and perfluorocyclobutaneC₄F₈on OxfordInstrumentsPlasmaPro®Estrelas100. It was found that in order to level the problems that arise, it is necessary to vary the temporal relations of etching and passivation stages.

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Periodical:

Key Engineering Materials (Volume 822)

Pages:

640-646

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.822.640

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Online since:

September 2019

Authors:

R.A. Alekseev*, Aleksandra I. Alieva, Ewelina Kucal

Keywords:

Bosch Process, Encapsulated Sensors, Micromechanical Gyroscopes, Silicon Etching, Silicon on Glass

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© 2019 Trans Tech Publications Ltd. All Rights Reserved

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