Design of Special Device for the Forced Electrolytic-Plasma Polishing of Internal Surfaces by Counter Flows

Ludmila A. Ushomirskaya; Yuri Mikhailovich Baron; Ivan Sergeevich Kuzmichev

doi:10.4028/www.scientific.net/KEM.822.610

Paper Titles

Control of Deviations in Lattice Structures Manufactured by Selective Laser Melting
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Registration of an ICP Plasma CV Dependences under Various Pressures in the Plasma-Chemical Deep Etching System
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Calculating the Nominal Values of the Matching Device Installation of Plasma Chemical Etching
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Microstructure and Mechanical Properties of Powder Steel 16Cr - 2Ni - Mn - Mo Obtained by Mechanical Alloying and Spark Plasma Sintering
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Design of Special Device for the Forced Electrolytic-Plasma Polishing of Internal Surfaces by Counter Flows
p.610

Effect of the Mechanical Alloying and Spark Plasma Sintering on Microstructure, Phase Composition and Chemical Elements Distribution of Nb-Si Based Composite
p.617

Plasma Chemical Synthesis of Aluminum Nitride Nanopowder
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Technological Principles of Internal Surfaces Finishing by Forced Electrolytic-Plasma Polishing
p.634

Aspect-Independent Siliconglass Etching by Bosch Method
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 822Design of Special Device for the Forced...

Design of Special Device for the Forced Electrolytic-Plasma Polishing of Internal Surfaces by Counter Flows

Abstract:

The practice shows availability of an electro plasma method polishing. The lack of a method, namely impossibility of its application for processing extended grooves and apertures is known. Creation of a special equipment and revealing of optimum modes have allowed to receive the given roughness on the named surfaces on products from cuprum.

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Periodical:

Key Engineering Materials (Volume 822)

Pages:

610-616

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.822.610

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Online since:

September 2019

Authors:

Ludmila A. Ushomirskaya, Yuri Mikhailovich Baron, Ivan Sergeevich Kuzmichev*

Keywords:

Boiling, Counter Flows, Electrode-Cathode, Electrolyte, Forced-Flow, Internal, Plasma, Plasma Cover, Processing, Roughness, Special Device, Surface, Thermal Balance, Uniformity

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* - Corresponding Author

References

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