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HomeKey Engineering MaterialsKey Engineering Materials Vols. 86-87Simulation of Ion Beam-Induced Collisional...

Simulation of Ion Beam-Induced Collisional Processes in Thin Film Titanium Silicide

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Engineered Materials

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Periodical:

Key Engineering Materials (Volumes 86-87)

Pages:

307-312

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.86-87.307

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Online since:

July 1993

Authors:

M. O'Connor, G.M. Crean, J.P. Biersack

Keywords:

Doped Silicide Bilayer, Implantation Modelling, Interface Mixing, Recoil Implantation, Sputtering, T-DYN, TiSi₂

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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