Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book gives an impressive demonstration of the diversity and richness of contemporary materials science.

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eBook:

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ToC:

Table of contents

Editors:

S. Hampshire, M. Buggy and A. J. Carr

DOI:

https://doi.org/10.4028/b-cE9bZJ

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Atomization-Milling Technologies, Ceramic Composite, Characterization, Component, Creep Crack Growth, Creep Deformation, Cutting Tool, Fatigue, Finite Element, Heat Transfer, Interply Slip, Laser Soldering, Low Alloy Steel, Process Control, Scanning Force Microscopy, Silicon-on-Insulator (SOI), Thermoforming, Thermoplastic, Thermoplastic Composite, Zirconia

Details:

Proceedings of the 8th Irish Materials Forum Conference (IMF 8), Dublin, Ireland, September 1992

Pages:

373

Year:

1993

ISBN-13:

9780878496655

ISBN-13 (CD):

9783038596585

ISBN-13 (eBook):

9783035703436

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