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Study of Grain Boundary Phase in Silicon Nitride Materials by Raman Spectroscopy
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Grain Growth in Si₃N₄
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Grain Boundary Fracture Resistance of Silicon Nitride
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R-Curve Behaviour and Subcritical Crack Growth of Reinforced Si₃N₄ Ceramics
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Die Pressing and Mechanical Behaviour of Silicon Nitride A Comparative Study of Three Different Powders
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 89-91Grain Boundary Fracture Resistance of Silicon...

Grain Boundary Fracture Resistance of Silicon Nitride

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Silicon Nitride '93

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Periodical:

Key Engineering Materials (Volumes 89-91)

Pages:

509-516

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.89-91.509

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Online since:

August 1993

Authors:

R. Tandon, David R. Clarke

Keywords:

Grain Boundary, Hot Isostatic Pressing (HIP), Indentation, Interfacial Fracture Resistance

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© 1994 Trans Tech Publications Ltd. All Rights Reserved

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