Development of High-Accuracy Simulation Test Technology for Hot Stamping

Akito Suzuki; Yasushi Fujii; Tatsumi Kimura; Masaki Kawano; Toru Inazumi

doi:10.4028/www.scientific.net/MSF.1016.1430

Paper Titles

Structure and Microstructure of Advanced Materials Characterized by Neutron Diffraction
p.1404

Evaluation of Interfacial Thermal Resistance of Al-AlN Composites by Using Image-Based Calculation
p.1411

The Effect of Ni Precursor Salts on Diatomite Supported Ni-Mg Catalysts in Methanation of CO₂
p.1417

Performance of a Matrix Type High Speed Steel after Deep Cryogenic and Low Tempering Temperature
p.1423

Development of High-Accuracy Simulation Test Technology for Hot Stamping
p.1430

Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High Temperature and High Humidity Aging
p.1436

Tensile Deformation of Si Single Crystals at High Temperatures
p.1443

In Situ Evaluation of the Joining Defects in a Pb-Free Soldered Joint
p.1448

Evaluation of Tensile Shear Strength for Lap Joint of Dissimilar Steels
p.1454

HomeMaterials Science ForumMaterials Science Forum Vol. 1016Development of High-Accuracy Simulation Test...

Development of High-Accuracy Simulation Test Technology for Hot Stamping

Abstract:

A new high temperature testing system was developed to evaluate high temperature deformation behavior in hot stamping process with high accuracy using a hybrid heating system consist of direct resistance heating and high-frequency induction heating. The uniform temperature distribution was achieved in the sheet steel tensile test specimen. The typical hot stamping thermal history was successfully simulated with the combination of the hybrid heating system and the gas cooling system. The strain distribution in high temperature deformation was confirmed to be uniform in the parallel portion of the specimen and the developed testing system may contribute to improving the accuracy in hot stamping CAE analysis.

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Periodical:

Materials Science Forum (Volume 1016)

Pages:

1430-1435

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1016.1430

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Online since:

January 2021

Authors:

Akito Suzuki*, Yasushi Fujii, Tatsumi Kimura, Masaki Kawano, Toru Inazumi

Keywords:

High Temperature Testing, High-Accuracy Simulation Test Technology, Hot Stamping

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References

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