Experimental Investigations on Strength of a Nano Doped 3D Printed Circuit Board for Application in Electronics Industry

Abstract:

The advancement in digital 3D printing technology is further evolved with the development of new deposition materials. The materials for fused deposition modelling are successfully implemented in the field of medical and electronics engineering application for printing actual working products. The present paper deals with the effect of three different raster orientation angles and a 0.5 wt.% dope of graphene on the tensile strength of samples made of acrylonitrile butadiene styrene as per ASTM-D638 standard. It is interesting to observe that the samples prepared with a raster orientation of 0° degree with respect to the longitudinal axis showed highest tensile strength followed by 45° and 90°. The similar trend is also observed with the samples doped with 0.5 wt.% graphene although the tensile strength is observed to increase by 50% than that of the samples of plain ABS. In order to explore the effect of strain rate on tensile strength of plain and doped ABS specimens, the experiments were also performed at a cross head speed of 300mm/min and found that the strain rate increases the tensile strength by 2 to 3 times depending upon the raster orientation angle during fabrication of the samples.

• Periodical: Materials Science Forum (Volume 1133)
• Pages: 69-74
• DOI: https://doi.org/10.4028/p-b9ixYx
• Online since: December 2024
• Authors: Bhavye Gautam*, Satpal Sharma, Anurag Singh Baghel, Raunaq Dua
• Keywords: 3D Printing, Acrylonitrile Butadiene Styrene, Fused Deposition Modelling, Graphene, Tensile Strength

References

[1] Wang, P., Zou, B., Xiao, H., Ding, S., & Huang, C. (2019). Effects of printing parameters of fused deposition modeling on mechanical properties, surface quality, and microstructure of PEEK. Journal of Materials Processing Technology, 271, 62-74.

DOI: 10.1016/j.jmatprotec.2019.03.016

[2] Macdonald, E., Salas, R., Espalin, D., Perez, M., Aguilera, E., Muse, D., & Wicker, R. B. (2014). 3D printing for the rapid prototyping of structural electronics. IEEE access, 2, 234-242.

DOI: 10.1109/access.2014.2311810

[3] Lazarus, N., & Tsang, H. H. (2020). 3-D printing structural electronics with conductive filaments. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(12), 1965-1972.

DOI: 10.1109/tcpmt.2020.3038563

[4] Penumakala, P. K., Santo, J., & Thomas, A. (2020). A critical review on the fused deposition modeling of thermoplastic polymer composites. Composites Part B: Engineering, 201, 108336.

DOI: 10.1016/j.compositesb.2020.108336

[5] Zhang, G., Lan, H., Qian, L., Zhao, J., & Wang, F. (2020). A microscale 3D printing based on the electric-field-driven jet. 3D Printing and Additive Manufacturing, 7(1), 37-44.

DOI: 10.1089/3dp.2018.0154

[6] Church, K. H., Tsang, H., Rodriguez, R., Defembaugh, P., & Rumpf, R. (2013, July). Printed circuit structures, the evolution of printed circuit boards. In IPC APEX EXPO Conference Proceedings.

[7] Bekas, D. G., Hou, Y., Liu, Y., & Panesar, A. (2019). 3D printing to enable multifunctionality in polymer-based composites: A review. Composites Part B: Engineering, 179, 107540.

DOI: 10.1016/j.compositesb.2019.107540

[8] Aguilera, E., Ramos, J., Espalin, D., Cedillos, F., Muse, D., Wicker, R., & MacDonald, E. (2013). 3D printing of electro mechanical systems. In 2013 International Solid Freeform Fabrication Symposium. University of Texas at Austin.

DOI: 10.1109/icsens.2013.6688247

[9] Abeykoon, C., Sri-Amphorn, P., & Fernando, A. (2020). Optimization of fused deposition modeling parameters for improved PLA and ABS 3D printed structures. International Journal of Lightweight Materials and Manufacture, 3(3), 284-297.

DOI: 10.1016/j.ijlmm.2020.03.003

[10] Xu, Y., & Deng, C. (2017, April). An investigation on 3D printing technology for power electronic converters. In 2017 IEEE 8th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) (pp.1-6). IEEE.

DOI: 10.1109/pedg.2017.7972486

[11] Barile, G., Esposito, P., Possemato, A., Stornelli, V., & Ferri, G. (2023, September). Design and Manufacture of 3D-Printed Circuit Boards. In Annual Meeting of the Italian Electronics Society (pp.402-413). Cham: Springer Nature Switzerland.

DOI: 10.1007/978-3-031-48711-8_49

[12] Al-Araji, Z. H., Swaikat, N. A., Muratov, A., & Turetsky, A. V. (2019, April). Modeling and experimental research of vibration n properties of a multi-layer printed circuit board. In 2019 4th Scientific International Conference Najaf (SICN) (pp.43-47). IEEE.

DOI: 10.1109/sicn47020.2019.9019364