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HomeMaterials Science ForumMaterials Science Forum Vols. 126-128Copper Precipitation at the Silicon/Silicon...

Copper Precipitation at the Silicon/Silicon Dioxide Interface: Microstructure and Electrical Properties

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Intergranular and Interphase Boundaries in Materials

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Periodical:

Materials Science Forum (Volumes 126-128)

Pages:

591-594

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.126-128.591

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Online since:

January 1993

Authors:

A. Correia, D. Ballutaud, J.L. Maurice

Keywords:

Copper Precipitation, Electron Beam Induced Current (EBIC), Si/SiO₂ Interface, TEM

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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