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HomeMaterials Science ForumMaterials Science Forum Vols. 140-142Evaluation of Substrate Degradation in Plasma Etch...

Evaluation of Substrate Degradation in Plasma Etch Processes Using Thermal Wave Analysis

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Plasma Properties, Deposition and Etching

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Periodical:

Materials Science Forum (Volumes 140-142)

Pages:

541-564

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.140-142.541

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Online since:

October 1993

Authors:

M. Engelhardt

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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