Investigation of the Behaviour of Stress in Metallization Thin Films for Microelectronics during Thermal Cycling using High-Temperature X-Ray Diffraction

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Periodical:

Materials Science Forum (Volumes 166-169)

Edited by:

R. Delhez and E.J. Mittemeijer

Pages:

307-312

DOI:

10.4028/www.scientific.net/MSF.166-169.307

Citation:

G.M. Zorn and M. Schneegans, "Investigation of the Behaviour of Stress in Metallization Thin Films for Microelectronics during Thermal Cycling using High-Temperature X-Ray Diffraction", Materials Science Forum, Vols. 166-169, pp. 307-312, 1994

Online since:

July 1994

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