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HomeMaterials Science ForumMaterials Science Forum Vols. 166-169Investigation of the Behaviour of Stress in...

Investigation of the Behaviour of Stress in Metallization Thin Films for Microelectronics during Thermal Cycling using High-Temperature X-Ray Diffraction

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Periodical:

Materials Science Forum (Volumes 166-169)

Pages:

307-312

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.166-169.307

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Online since:

July 1994

Authors:

G.M. Zorn, M. Schneegans

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© 1994 Trans Tech Publications Ltd. All Rights Reserved

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