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HomeMaterials Science ForumMaterials Science Forum Vols. 228-231New Opportunities in the Texture and Stress Field...

New Opportunities in the Texture and Stress Field by the Whole Pattern Analysis

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Periodical:

Materials Science Forum (Volumes 228-231)

Pages:

83-88

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.228-231.83

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Online since:

July 1996

Authors:

Maurizio Ferrari, Luca Lutterotti, Siegfried Matthies, P. Polonioli, H.R. Wenk

Keywords:

Elastic Modulus, ODF Calculation, Residual Stress, Rietveld Method, Texture, WIMV

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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