Paper Titles

Wetting of Grain Boundaries in Metals and Ceramics
p.1

On the Relationship between Grain-Boundary Migration and Grain-Boundary Diffusion by Molecular-Dynamics Simulation
p.9

Application of Surface Ab Initio Methods to Studies of Electronic Structure and Atomic Configuration of Interfaces in Metallic Materials
p.17

High Resolution Study of a Quasiperiodic Grain Boundary in Gold
p.27

Effect of Grain Boundary Dislocations on 9R Stacking Errors at an Incoherent Twin Boundary in Copper
p.35

In situ High-Resolution Transmission Electron Microscopy of Interfaces in Phase Transformations
p.43

The Effects of Thermomechanical Processing on Interfacial Crystallography in Metals
p.51

Grain Boundaries in Superplastic Ceramics
p.59

Radiation-Induced Grain Boundary Segregation
p.67

HomeMaterials Science ForumMaterials Science Forum Vols. 294-296Wetting of Grain Boundaries in Metals and Ceramics

Wetting of Grain Boundaries in Metals and Ceramics

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

1-8

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.1

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Online since:

November 1998

Authors:

David R. Clarke

Keywords:

Grain Boundary, Intergranular Films, Segregation, Wetting

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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