Paper Titles

Wetting of Grain Boundaries in Metals and Ceramics
p.1

On the Relationship between Grain-Boundary Migration and Grain-Boundary Diffusion by Molecular-Dynamics Simulation
p.9

Application of Surface Ab Initio Methods to Studies of Electronic Structure and Atomic Configuration of Interfaces in Metallic Materials
p.17

High Resolution Study of a Quasiperiodic Grain Boundary in Gold
p.27

Effect of Grain Boundary Dislocations on 9R Stacking Errors at an Incoherent Twin Boundary in Copper
p.35

In situ High-Resolution Transmission Electron Microscopy of Interfaces in Phase Transformations
p.43

The Effects of Thermomechanical Processing on Interfacial Crystallography in Metals
p.51

Grain Boundaries in Superplastic Ceramics
p.59

Radiation-Induced Grain Boundary Segregation
p.67

HomeMaterials Science ForumMaterials Science Forum Vols. 294-296On the Relationship between Grain-Boundary...

On the Relationship between Grain-Boundary Migration and Grain-Boundary Diffusion by Molecular-Dynamics Simulation

Article Preview

Abstract:

You might also be interested in these eBooks

Intergranular and Interphase Boundaries in Materials III

Info:

Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

9-16

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.9

Citation:

Cite this paper

Online since:

November 1998

Authors:

B. Schönfelder, P. Keblinski, D. Wolf, S.R. Phillpot

Keywords:

Grain Boundary Diffusion, Grain Boundary Migration, Molecular Dynamic Simulation, Structure-Sensitive Properties

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1999 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: