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HomeMaterials Science ForumMaterials Science Forum Vols. 294-296Grain Boundary Modification During Long-Term Creep...

Grain Boundary Modification During Long-Term Creep in Silicon Nitride

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

621-624

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.621

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Online since:

November 1998

Authors:

František Lofaj, Hui Gu, Atsushi Okada, Hiroshi Kawamoto

Keywords:

Crystalline Secondary Phases, Epitaxial Growth, Tensile Creep, Transformation, Ytterbium Disilicate, Ytterbium Oxynitride

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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