Grain Boundary Modification During Long-Term Creep in Silicon Nitride

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Periodical:

Materials Science Forum (Volumes 294-296)

Edited by:

Pavel Lejcek and Václav Paidar

Pages:

621-624

DOI:

10.4028/www.scientific.net/MSF.294-296.621

Citation:

F. Lofaj et al., "Grain Boundary Modification During Long-Term Creep in Silicon Nitride", Materials Science Forum, Vols. 294-296, pp. 621-624, 1999

Online since:

November 1998

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Price:

$35.00

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