Paper Titles

Thermoelectric Properties of CoSi Thin films
p.3445

Structural and Mechanical Properties of Stainless Steel Thin Films Elaborated by Thermal Evaporation and Ion Beam Sputtering
p.3451

Formation of Calcium Phosphate Film on Ti Substrate in Aqueous Solutions in the Control of Temperature and Ion Activity
p.3457

The Effect of Lattice Strain on the Step Edge Diffusion and Morphological Development during Epitaxial Growth
p.3463

Evaluation of Interface Strength between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the Basis of Fracture Mechanics Concept
p.3469

TiNi Thin Films for Microactuators and Microdevices: Sputter Deposition and Processing Techniques
p.3475

The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films
p.3481

Near-Zero-Thickness Self-Assembled Molecular Layers for Future Device Structures: Interfacial Adhesion and Diffusion Barrier Properties
p.3487

Thermally Activated Flux Creep in High T_c Superconductors
p.3493

HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Evaluation of Interface Strength between Thin...

Evaluation of Interface Strength between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the Basis of Fracture Mechanics Concept

Article Preview

Abstract:

You might also be interested in these eBooks

THERMEC'2003

Info:

Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3469-3474

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3469

Citation:

Cite this paper

Online since:

August 2003

Authors:

Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu, Masaki Shiratori

Keywords:

Finite Element Analysis (FEA), Fracture Mechanic, Interface Strength, LSI Conductor, Silicon Substrates, Stress Intensity, Thin Film

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2003 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: