Paper Titles

The Effect of Lattice Strain on the Step Edge Diffusion and Morphological Development during Epitaxial Growth
p.3463

Evaluation of Interface Strength between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the Basis of Fracture Mechanics Concept
p.3469

TiNi Thin Films for Microactuators and Microdevices: Sputter Deposition and Processing Techniques
p.3475

The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films
p.3481

Near-Zero-Thickness Self-Assembled Molecular Layers for Future Device Structures: Interfacial Adhesion and Diffusion Barrier Properties
p.3487

Thermally Activated Flux Creep in High T_c Superconductors
p.3493

Improved-Trapped Magnetic Fields in Top Seeded Melt Grown YBCO Superconductor Doped with Depleted and Enriched Uranium Oxide
p.3499

Metallic Buffer Layers for Y-123 Coated Conductor
p.3505

Copper and CuNi Alloys Substrates for HTS Coated Conductor Applications Protected from Oxidation
p.3511

HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Near-Zero-Thickness Self-Assembled Molecular...

Near-Zero-Thickness Self-Assembled Molecular Layers for Future Device Structures: Interfacial Adhesion and Diffusion Barrier Properties

Article Preview

Abstract:

You might also be interested in these eBooks

THERMEC'2003

Info:

Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3487-3492

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3487

Citation:

Cite this paper

Online since:

August 2003

Authors:

P.G. Ganesan, G. Cui, A.V. Ellis, R.S. Kane, G. Ramanath

Keywords:

Diffusion Barrier, Interfacial Adhesion, Self-Assembled Molecular Layers

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2003 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: