The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

3481-3486

DOI:

10.4028/www.scientific.net/MSF.426-432.3481

Citation:

Y. C. Joo et al., "The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films", Materials Science Forum, Vols. 426-432, pp. 3481-3486, 2003

Online since:

August 2003

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$35.00

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