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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432The Effect of Grain Boundary Characteristics on...

The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3481-3486

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3481

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Online since:

August 2003

Authors:

Young Chang Joo, Soo Jung Hwang, Hyun Park

Keywords:

Copper (Cu), Diffusion, Electroplating, Microstructure, Sputtering, Stress Voiding, Thin Film

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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