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HomeMaterials Science ForumMaterials Science Forum Vol. 439Mechanical and Thermal Properties of Hot-Pressed...

Mechanical and Thermal Properties of Hot-Pressed Si₃N₄ with Added AlN

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Periodical:

Materials Science Forum (Volume 439)

Pages:

119-124

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.439.119

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Online since:

November 2003

Authors:

Rak Joo Sung, S.W. Lee, Tadachika Nakayama, Takafumi Kusunose, Tohru Sekino, Koichi Niihara

Keywords:

Aluminum Nitride (AlN), Hot-Pressing, Thermal Conductivity (TC)

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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