Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application

Abstract:

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Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.

Info:

Periodical:

Materials Science Forum (Volumes 449-452)

Edited by:

S.-G. Kang and T. Kobayashi

Pages:

393-396

DOI:

10.4028/www.scientific.net/MSF.449-452.393

Citation:

D. G. Kim et al., "Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application", Materials Science Forum, Vols. 449-452, pp. 393-396, 2004

Online since:

March 2004

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Price:

$35.00

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