Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures
p.3641
p.3641
Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films
p.3647
p.3647
Phase Separation into Nano-Crystalline Nitrides in Ternary Ti-Si-N System via N Implantation
p.3651
p.3651
TiC/a-C Nanocomposite Coatings for Low Friction and Wear Resistance
p.3655
p.3655
The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehang Buckle
p.3661
p.3661
Computer Simulations on Mechanical Properties of Molecular Deposition Film
p.3665
p.3665
Stress Induced Anisotropic Diffusion during Plasma-Assisted Nitriding of a Ni-Based Alloy
p.3669
p.3669
Numerical Simulation and Experimental Evidence for Surface Modification by High Current Pulsed Electron Beam
p.3673
p.3673
A Novel Efficient Blue Organic Light Emitting Structure
p.3677
p.3677
The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehang Buckle
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Periodical:
Materials Science Forum (Volumes 475-479)
Pages:
3661-3664
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Online since:
January 2005
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© 2005 Trans Tech Publications Ltd. All Rights Reserved
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