Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films

G.P. Zhang; Cynthia A. Volkert; Ruth Schwaiger; Oliver Kraft

doi:10.4028/www.scientific.net/MSF.475-479.3647

Paper Titles

Influence of Film Thickness on Intrinsic Growth Stress and Raman Evaluation of Tetrahedral Amorphous Carbon Films
p.3627

Microstructures and Properties of the DLC Films Prepared by PLD Process Using High Power High Frequency 308 nm Laser Beam
p.3631

Improvement of Adhesion of Cubic Boron Nitride Films: Effect of Interlayer and Deposition Parameters
p.3635

Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures
p.3641

Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films
p.3647

Phase Separation into Nano-Crystalline Nitrides in Ternary Ti-Si-N System via N Implantation
p.3651

TiC/a-C Nanocomposite Coatings for Low Friction and Wear Resistance
p.3655

The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehang Buckle
p.3661

Computer Simulations on Mechanical Properties of Molecular Deposition Film
p.3665

HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Microscopic Investigation of Strain Localization...

Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films

Abstract:

Fatigue damage behaviour in micron and sub-micron thick Cu films has been investigated using focused ion beam (FIB) microscopy and transmission electron microscopy (TEM). The observations show that cyclic strain localization in the fatigued thin films is affected by the physical dimensions of the material, as evidenced by changes in the extrusion dimensions and by changes in the dislocation structures. The significant decrease in extrusion dimensions and the suppression of the development of bulk-like dislocation structures with decreasing film thickness and grain size is attributed to the strong inhibition of dislocation mobility and activity at small length scales.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

3647-3650

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.3647

Citation:

Cite this paper

Online since:

January 2005

Authors:

G.P. Zhang, Cynthia A. Volkert, Ruth Schwaiger, Oliver Kraft

Keywords:

Dislocation Structure, Fatigue, Length Scale, Size Effect, Thin Film

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] W. D. Nix: Metall. Trans. A Vol. 20 (1989), p.2217.

Google Scholar

[2] E. Arzt: Acta Mater. Vol. 46 (1998), p.5611.

Google Scholar

[3] S. Hong and R. Weil: Thin Solid Films, Vol. 283 (1996), p.175.

Google Scholar

[4] D. T. Read: Int. J. Fatigue Vol. 20 (1998), p.203.

Google Scholar

[5] R. Schwaiger and O. Kraft: Scripta Mater. Vol. 41 (1999), p.823.

Google Scholar

[6] O. Kraft, R. Schwaiger and P. Wellner: Mater. Sci. Eng. A Vol. 319-321 (2001), p.919.

Google Scholar

[7] O. Kraft. P. Wellner, M. Hommel, R. Schwaiger and E. Arzt: Z. Metall. Vol. 93 (2002), p.392.

Google Scholar

[8] R. Schwaiger and O. Kraft: Acta Mater. Vol. 51 (2003), p.195.

Google Scholar

[9] R. Schwaiger, G. Dehm, and O. Kraft: Phil. Mag. Vol. 83 (2003), p.693.

Google Scholar

[10] G. P. Zhang, R. Schwaiger, C. A. Volkert and O. Kraft: Phil. Mag. Vol. 83 (2003), p.477.

Google Scholar

[11] R. Keller, S. P. Baker and E. Arzt: Acta Mater. Vol. 47 (1999), p.2865.

Google Scholar

[12] M. Hommel and O. Kraft: Acta Mater. Vol. 459 (2001), p.3935 Fig. 5 Schematic illusion of constraint effects of (a) film thickness and (b) grain size on dislocation activity.

Google Scholar