The Use of Trimethylaluminum for Producing Surface Layers by the PACVD Method

Jerzy Robert Sobiecki; R. Sitek; Tadeusz Wierzchoń

doi:10.4028/www.scientific.net/MSF.475-479.3887

Paper Titles

Distribution of Plane Matching Boundaries for Different Types and Sharpness of Textures
p.3871

In Situ HREM Studies of Grain Boundary Formation during Solidification of B-Doped Silicon
p.3875

Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate
p.3879

Structure and Properties of Ti-Al Intermetallic Layers Produced on Titanium Alloys by a Duplex Treatment
p.3883

The Use of Trimethylaluminum for Producing Surface Layers by the PACVD Method
p.3887

Control of Boundary Structure and Grain Growth for Microstructural Design
p.3891

Hydrophilic Properties of TiO₂-Al₂O₃ Composite Thin Films
p.3897

Properties of DLC Films Produced by Pulsed Laser Induced Arc Deposition
p.3901

Process of Film Formation By Anodizing AZ91D Magnesium Alloy
p.3905

HomeMaterials Science ForumMaterials Science Forum Vols. 475-479The Use of Trimethylaluminum for Producing Surface...

The Use of Trimethylaluminum for Producing Surface Layers by the PACVD Method

Abstract:

The paper presents the use of trimethylaluminum in PACVD method to obtain the surface layers like alumina or aluminum nitride on Inconel nickel alloy. The glow discharge nitriding at a temperature of 750°C leads to the formation of aluminum oxynitride in the layer, whereas annealing in argon plasma at a temperature of 1050°C – to the formation of nickel and aluminum based intermetallic phases of the NiAl or Ni3Al type with aluminum oxide present within the outer zone of the coating. The presence of the surface layer of the Al2O3+NiAl+Ni3Al type formed on nickel alloys may be significant from the point of view of the applications that require a high heat resistance.

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Materials Science Forum (Volumes 475-479)

Pages:

3887-3890

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.3887

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Online since:

January 2005

Authors:

Jerzy Robert Sobiecki, R. Sitek, Tadeusz Wierzchoń

Keywords:

Aluminum (Al), Aluminum Nitride (AlN), PACVD Method, Trimethylaluminum

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