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The Evaluation of the Elastic Property in Nano-Scaled Thin Compressive Film on Patterned Substrates

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Abstract:

The evaluation of elastic property for thin diamond-like carbon (DLC) films has been presented with buckle analysis of compressive stressed film on patterned substrate. When substrate has been patterned with adhesion release layer, the morphologies of buckle configuration on patterned layer has been controlled from straight sided (Euler) buckle to nonlinear telephone cord type buckle with respect to the pattern width. By using the simple equation for Euler buckle, the elastic modulus has been easily calculated, shown well consistent with the results by nano-indentation test.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

3935-3938

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.3935

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Online since:

January 2005

Authors:

M.W. Moon, T.Y. Kim, Kwang Real Lee, Kyu Hwan Oh

Keywords:

Elastic Modulus, Euler Buckle, Patterned Substrate

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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