Effect of Colloidal Silica Addition and Pre-Coating on the Microstructure Change of Cathode Copper Electrodeposited Film

Abstract:

The crystal structure, surface morphology and preferred orientation of copper electro-deposit were investigated by using sulfate bath with SiO2 suspension and the cathode substrate Au-sputtered. By addition of colloidal silica in copper electrolytic bath and Au pre-coating on substrate, the grains of deposits became fined and uniform and the number of grains were increased. Hardness of copper electrodeposits with colloidal silica increased about 15% in comparison with that of pure copper deposit film. The (111), (200) and (311) planes in the X-ray diffraction patterns were almost swept away, so preferred orientation of copper deposits change from (111) to (110) plane by co-deposit SiO2 and pre-coating the substrate.

• Periodical: Materials Science Forum (Volumes 475-479)
• Pages: 3931-3934
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.475-479.3931
• Online since: January 2005
• Authors: Sang Baek Lee, Yung Keun Kim, Byung Il Kim
• Keywords: Au Pre-Coating, Colloidal Silica, Copper Electrodeposited Film, Crystal Structure, Sulfate Copper Electrolytic Bath

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