Polishing Glass-Ceramic Based Rigid Disk

S.Y. Chen; Shin Chieh Lin; Hong Ho Cheng

doi:10.4028/www.scientific.net/MSF.505-507.1213

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HomeMaterials Science ForumMaterials Science Forum Vols. 505-507Polishing Glass-Ceramic Based Rigid Disk

Polishing Glass-Ceramic Based Rigid Disk

Abstract:

In this study, experiments were conducted to reveal effects of polishing parameters on surface characteristics and removal rate when polishing glass-ceramic based rigid disk. The parameters studied including rotational speed, applied pressure, and abrasive concentration. Experimental results show that surface roughness, waviness and removal rate could be improved by adjusting the levels of polishing parameters.

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Materials Science Forum (Volumes 505-507)

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1213-1218

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https://doi.org/10.4028/www.scientific.net/MSF.505-507.1213

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Online since:

January 2006

Authors:

S.Y. Chen, Shin Chieh Lin, Hong Ho Cheng

Keywords:

Ceramic, Glass, Polishing, Rigid Disk

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References

[1] I. Ali, S.R. Roy, and G. Shinn, Solid State Technology, Vol. 37 (1994), p.63.

Google Scholar

[2] M. Desai, R. Jairath, M. Stell, and R. Tolles, Mat. Res. Soc. Sym. Proc., Vol. 227 (1994), p.99.

Google Scholar

[3] J.M. Steigerwald, S. P. Murarka and R.J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, (1997).

DOI: 10.1002/9783527617746

Google Scholar

[4] D.C. Montgomery, Design and Analysis of Experiments, John Wiley & Sons, (1997).

Google Scholar

[5] F.W. Preston, Journal of the Society of Glass Technology, Vol. 11, (1927), p.214.

Google Scholar

[6] L.M. Cook, Journal of Non-Crystalline Solids, Vol. 120, (1990), p.152.

Google Scholar

[7] T. Karaki-doy, T. Nakagawa, and T. Kasai, Int. J. Japan Soc. Precision Eng., Vo. 29, (1995), p.217.

Google Scholar

[8] M. Bhushan, R. Rouse, R. and J. E. Lukens, J. of the Electrochemical Society, Vol. 11, (1995), p.3845.

Google Scholar

[9] F.G. Shi, and B. Zhao, Applied Physics A: Materials Science & Processing, Vo. 67, (1998), p.249.

Google Scholar

[10] P.L. Flaitz, and M. Neisser, American Ceramic Society Bulletin, Vol. 73, (1994), p.42.

Google Scholar

[11] C.H. Hsu, Effects of polishing parameters on surface characteristics, M.S. thesis (in Chinese), National Tsing Hua University, Taiwan, (1998).

Google Scholar

[12] T. Nakamura, K. Akamatsu, and N. Arakawa, Bul. of Japan Soc. of Precision Eng., Vol. 19, (1985), p.120.

Google Scholar