A Pulse DC Plasma Deposited Resistor Process

Abstract:

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The pulse DC plasma system offers so highly instant power to generate extremely intense plasma density that its applications are widely extended. In this work, the development of pulse DC plasma processing is studied for the sheet resistors, and the manufacturing mechanism relative to the properties of copper particles deposited on plastic materials is discussed by using atomic force microscopy and line-resistance measured technique.

Info:

Periodical:

Materials Science Forum (Volumes 505-507)

Edited by:

Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng

Pages:

865-870

DOI:

10.4028/www.scientific.net/MSF.505-507.865

Citation:

F. L. Wen et al., "A Pulse DC Plasma Deposited Resistor Process", Materials Science Forum, Vols. 505-507, pp. 865-870, 2006

Online since:

January 2006

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Price:

$35.00

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