TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Jeong Won Yoon; Seung Boo Jung

doi:10.4028/www.scientific.net/MSF.510-511.554

Paper Titles

Effects of La₂O₃ on the Piezoelectric Properties of Lead-Free (Bi_0.5Na_0.5)_0.94Ba_0.06TiO₃ Piezoelectric Ceramics
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Quantitative Analysis of Micro-Macro Domain Transition of PNN-PT-PZ(x) System at Higher PZ Content
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Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength
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Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps
p.550

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
p.554

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock
p.558

The Effect of Boron on the Sliding Wear Behavior of Iron-Based Hardfacing Alloys for Nuclear Power Plants Valves
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Sliding Wear Behaviors of Steam Generator Tubes in Various Environments
p.566

Fabrication of Lead Free Micro Solder Powder by Melts Dispersion Technique
p.570

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TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Abstract:

The interfacial reaction between eutectic Sn-3.5Ag solder and ENIG substrate during reflow was investigated. During the reflow, the topmost Au layer dissolved into the molten solder, and the reaction layers of Ni3Sn4/Ni-Sn-P/Ni3P formed between Sn-Ag solder and Ni-P plating layer. After the reflow at 255 for 3 min, most of Ni3Sn4 intermetallic compound (IMC) spalled off the substrate. The formation of thick Ni3P and Ni-Sn-P layers was related to the direct reaction between solder and Ni-Sn-P layer by the IMC spalling.