Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route

O. Ozer; J.M. Missiaen; Celine Pascal; Sabine Lay; Jean Marc Chaix; Raphael Mitteau

doi:10.4028/www.scientific.net/MSF.534-536.1569

Paper Titles

Thermoelectric Material Design in Pseudo Binary Systems of Mg₂Si – Mg₂Ge – Mg₂Sn on the Powder Metallurgy Route
p.1553

Thermoelectric Properties of Fe-Doped CoSb₃ Prepared by Encapsulated Induction Melting and Hot Pressing
p.1557

Thermoelectric Properties of Ni-Doped CoSb₃ Prepared by Encapsulated Induction Melting and Hot Pressing
p.1561

Thermomechanical Properties of Functionally Graded Al-SiC_p Composites
p.1565

Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route
p.1569

Wear Resistance Properties of Tungsten Carbide/Stainless Steel Composite Materials Prepared by Pulsed Current Sintering
p.1573

High Temperature Microstructural Stability of Si₃N₄ in TiAl Alloys
p.1577

Ni₃Al-Fe-Cr Alloy Processed by Combined Mechanical Alloying - Reactive Synthesis
p.1581

Preparation, Structure, and Properties of Ni₃Al and NiAl Light Powder Alloys for Aerospace
p.1585

HomeMaterials Science ForumMaterials Science Forum Vols. 534-536Tungsten/Copper Functionally Graded Materials:...

Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route

Abstract:

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smoothes the composition gradient. Perspectives to control this migration are discussed.