Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route

Abstract:

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Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smoothes the composition gradient. Perspectives to control this migration are discussed.

Info:

Periodical:

Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim

Pages:

1569-1572

DOI:

10.4028/www.scientific.net/MSF.534-536.1569

Citation:

O. Ozer et al., "Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route", Materials Science Forum, Vols. 534-536, pp. 1569-1572, 2007

Online since:

January 2007

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$35.00

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