Paper Titles

Thermoelectric Properties of Ni-Doped CoSb₃ Prepared by Encapsulated Induction Melting and Hot Pressing
p.1561

Thermomechanical Properties of Functionally Graded Al-SiC_p Composites
p.1565

Tungsten/Copper Functionally Graded Materials: Possible Applications and Processing through the Powder Metallurgy Route
p.1569

Wear Resistance Properties of Tungsten Carbide/Stainless Steel Composite Materials Prepared by Pulsed Current Sintering
p.1573

High Temperature Microstructural Stability of Si₃N₄ in TiAl Alloys
p.1577

Ni₃Al-Fe-Cr Alloy Processed by Combined Mechanical Alloying - Reactive Synthesis
p.1581

Preparation, Structure, and Properties of Ni₃Al and NiAl Light Powder Alloys for Aerospace
p.1585

Structure and Properties of MASHS Titanium Aluminide–Based Powder Alloyed with Chromium
p.1589

Effect of Processing Factors on Critical Current Density in Bi2212/Ag Wires
p.1593

HomeMaterials Science ForumMaterials Science Forum Vols. 534-536High Temperature Microstructural Stability of...

High Temperature Microstructural Stability of Si₃N₄ in TiAl Alloys

Article Preview

Abstract:

Alloys of Ti-50 at.% Al with (3 and 10)wt.% Si3N4 particles were prepared by a mechanical alloying-spark plasma sintering (MA-SPS) method. The matrix consisted primarily of TiAl, Ti2AlN, TiN. Si3N4 was unstable in the matrix and started to decompose forming a Ti5Si3 reaction layer on the surface of former Si3N4 particles during sintering and heat treatment at 1373 K.

You might also be interested in these eBooks

Progress in Powder Metallurgy

Info:

Periodical:

Materials Science Forum (Volumes 534-536)

Pages:

1577-1580

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.534-536.1577

Citation:

Cite this paper

Online since:

January 2007

Authors:

Jee Hoon Choi, Dong Bok Lee

Keywords:

Microstructure, Titanium Aluminide

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] D.B. Lee, Y.C. Park, Y.J. Kim and S.W. Park, Oxid. Met. Vol. 54 (2000) p.575.

[2] H. Hashimoto, Materia. Vol. 38 (1999) p.68.

[3] M.J. Bennett and M.R. Houlton, J. Mater. Sci. Vol. 14 (1979) p.184.

[4] G. P. Wagner and G. Simkovich, Oxid. Met. Vol. 27 (1987) p.157.

[5] I. Gotman and E.Y. Gutmanas, J. Mater. Sci. Lett. Vol. 9 (1990) p.813.

[6] J. Newkirk and D. Dixon, Mater. Sci. Eng. A Vol. 153 (1992) p.662.

[46] 11(Ti+N) + 45. 18(Al) + 8. 71(O).

[4] [42] 94(Ti+N) + 40. 62(Al) + 10. 96(O) + 5. 48(Si).

[3] [59] 21(Ti+N) + 20. 74(Al) + 11. 95(O) + 8. 10(Si).

[2] [91] 98(Si) + 5. 69(Ti+N) + 1. 21(O) + 1. 12(Al).

[1] Concentration ( at% ) Position.

[46] 11(Ti+N) + 45. 18(Al) + 8. 71(O).

[4] [42] 94(Ti+N) + 40. 62(Al) + 10. 96(O) + 5. 48(Si).

[3] [59] 21(Ti+N) + 20. 74(Al) + 11. 95(O) + 8. 10(Si).

[2] [91] 98(Si) + 5. 69(Ti+N) + 1. 21(O) + 1. 12(Al).

[1] Concentration ( at% ) Position (b).

[45] 29(Ti+N) + 29. 51(Al) + 23. 16(O) + 2. 04(Si).

[3] [39] 75(Al) + 36. 09(Ti+N) + 22. 97(O) + 1. 19(Si).

[2] [73] 95(Si) + 17. 21(O) + 8. 84(Al).

[1] Concentration ( at% ) Position.

[45] 29(Ti+N) + 29. 51(Al) + 23. 16(O) + 2. 04(Si).

[3] [39] 75(Al) + 36. 09(Ti+N) + 22. 97(O) + 1. 19(Si).

[2] [73] 95(Si) + 17. 21(O) + 8. 84(Al).

[1] Concentration ( at% ) Position (b) 1 2 3 4 (a) 10㎛ 2 1 3 (a) 10㎛.