Multi-Scale Numerical-Experimental Analysis of Failure in Solder Alloys

Abstract:

The past years have triggered considerable scientific efforts towards the predictive analysis of the reliability of solder connections in micro-electronics. Undoubtedly, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational and experimental multi-scale analysis of the microstructure evolution and degradation of the conventional solder material Sn-Pb and its most promising lead-free alternative, a Sn-Ag-Cu (SAC) alloy. Special attention is given to the thermal anisotropy of bulk SAC and the interfacial fatigue failure of SAC interconnects.

• Periodical: Materials Science Forum (Volumes 539-543)
• Pages: 66-73
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.539-543.66
• Online since: March 2007
• Authors: M.G.D. Geers, R.L.J.M. Ubachs, M. Erinc, M.A. Matin
• Keywords: Coarsening, Cohesive Zone, Damage, Failure, Interconnect, Interfacial Fracture, Metallization Layer, Multi-Scale, Solder Alloys, Thermal Anisotropy

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