Cu/GDC Cermet Anodes by Sintering via Surface Modification with MgO Sol

Kyoung Ran Han; Youn Ji Jeong; Chang Sam Kim; Hai Won Lee

doi:10.4028/www.scientific.net/MSF.544-545.953

Paper Titles

Dependence of the Dielectric Properties of Pt/ZrO₂/Si Capacitors Prepared by RF-Magnetron Sputtering on the Oxygen Partial Pressure and the Annealing Temperature
p.937

Fabrication of n-HA/CS Porous Scaffold Carrying Ampicillin-Loaded Microspheres
p.941

A Study on the Electrochemical Properties of PEO-Carbon Composite Polymer Electrolytes for Lithium/Sulfur Battery
p.945

Characteristics of Fluorine-Doped Tin Oxide Thin Films on Poly Ethylene Terephthalate (PET) Substrate
p.949

Cu/GDC Cermet Anodes by Sintering via Surface Modification with MgO Sol
p.953

Cycling Performance of LiFePO₄ as the Cathode Materials for Lithium Polymer Batteries
p.957

Densification and Dielectric Properties of Glass/Ceramic Composites Sintered with Various Borosilicate Glass
p.961

Design of Manufacturing Process of Oxygen-Free High Conductivity Copper Using Mahalanobis-Distance Outlier Detection Method
p.965

Development of Honeycomb-Type Solid Oxide Fuel Cell Consisting of LaGaO₃ Electrolyte
p.969

HomeMaterials Science ForumMaterials Science Forum Vols. 544-545Cu/GDC Cermet Anodes by Sintering via Surface...

Cu/GDC Cermet Anodes by Sintering via Surface Modification with MgO Sol

Abstract:

CuO/GDC composite powder with 50 wt% of CuO was prepared by surface modification of ~60 nm GDC powder with Cu precursors. Since copper oxide melts at lower temperature than GDC sintering temperature, fabrication procedure was modified by inducing infiltration of molten copper oxide via capillary force and then followed by heat treatment at ~1000. Surface modification was carried out with a MgO sol to suppress agglomeration of GDC. Such prepared Cu/GDC cermets showed uniform microstructure and excellent electronic conductivity of ~8500 S/cm for the Cu/GDC cermet and ~10200 S/cm for the modified one at 800.