Scale Effects in the High Temperature Gas Pressure Forming of Electrodeposited Fine-Grained Copper Thin Sheet

Abstract:

Article Preview

Scale effects in the high temperature gas pressure forming of electrodeposited fine-grained copper thin sheets were investigated by a series of tests at various forming temperatures and die apertures. The average as-deposited copper grain size was 5 μm. The geometrical parameters of the bugling die system and the thickness of copper sheet varied in proportion. Different radius hemisphere parts from 0.5mm to 5mm were obtained at a strain rate of 5.0×10−4 s−1, which was controlled by pressure forces curves determined in terms of a finite element method (FEM) based on constitutive equation proposed by Backoften in 1964. The experimental relative bulging height (RBH) values were measured, and compared with that predicted by the same finite element method (FEM). It was found that the experimental values of large scale parts approach to simulated values, whereas the experimental values of small scale parts were quite different from simulated values. In order to explain these phenomena, a grain-rotation-weakened mechanism was proposed.

Info:

Periodical:

Materials Science Forum (Volumes 551-552)

Edited by:

K.F. Zhang

Pages:

347-353

DOI:

10.4028/www.scientific.net/MSF.551-552.347

Citation:

K. Lei et al., "Scale Effects in the High Temperature Gas Pressure Forming of Electrodeposited Fine-Grained Copper Thin Sheet", Materials Science Forum, Vols. 551-552, pp. 347-353, 2007

Online since:

July 2007

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.