Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

Abstract:

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The growth and morphology of the intermetallic compounds (IMC) formed at the interface between the solder ( Sn–3.5Ag–0.5Cu ) and the Cu substrate of the lead - free solder joint have been investigated by means of isothermal aging at 125°C. The scalloped Cu6Sn5 intermetallic compound layer was formed at the interface between the solder and Cu substrate upon reflow. The thickness of Cu6Sn5 layer increased with aging time. Cu3Sn appeared between Cu6Sn5 layer and Cu substrate when isothermally aged for 100 hours. Compare to Cu6Sn5 , the thickness of Cu3Sn was rather low, and nearly did not increase with aging time. In this paper, the comparison was made among the Sn-Pb and the Sn-Ag-Cu(SAC) solders which were pre-treated differently before soldering.

Info:

Periodical:

Materials Science Forum (Volumes 561-565)

Main Theme:

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

2115-2118

DOI:

10.4028/www.scientific.net/MSF.561-565.2115

Citation:

Y. Fu et al., "Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint", Materials Science Forum, Vols. 561-565, pp. 2115-2118, 2007

Online since:

October 2007

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$35.00

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