Future Material Systems: Requirements and Applications

Abstract:

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Requirements and applications for three different scenarios in material science of microelectronics are discussed. Dimension scaling continous at the same pace (More Moore) by changing to immersion lithography and later to extreme ultraviolet lithography. The functionality of system on chip solutions will be increased by heterogeneous technologies combined with a microelectronics core ( More than Moore). Material science and physical understanding of new device principles started well in advance to judge difficulties and options. The strong links to economy are illustrated by a simple model of exponential growth.

Info:

Periodical:

Edited by:

Erich Kasper, Hans-Joachim Müssig and Hermann G Grimmeiss

Pages:

17-26

DOI:

10.4028/www.scientific.net/MSF.608.17

Citation:

E. Kasper et al., "Future Material Systems: Requirements and Applications", Materials Science Forum, Vol. 608, pp. 17-26, 2009

Online since:

December 2008

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Price:

$35.00

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