Future Material Systems: Requirements and Applications

Abstract:

Requirements and applications for three different scenarios in material science of microelectronics are discussed. Dimension scaling continous at the same pace (More Moore) by changing to immersion lithography and later to extreme ultraviolet lithography. The functionality of system on chip solutions will be increased by heterogeneous technologies combined with a microelectronics core ( More than Moore). Material science and physical understanding of new device principles started well in advance to judge difficulties and options. The strong links to economy are illustrated by a simple model of exponential growth.

• Periodical: Materials Science Forum (Volume 608)
• Pages: 17-26
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.608.17
• Online since: December 2008
• Authors: Erich Kasper, Hans Joachim Müssig, Hermann G. Grimmeiss
• Keywords: Beyond CMOS, Integrated Circuits, Lithography, Market Volume, Self-Organization, Semiconductor, System on Chip (SoC)

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