Properties of Pt-Assisted Electroless Etched Silicon in HF/Na2S2O8 Solution

N. Megouda; T. Hadjersi; O. El Kachai; R. Boukherroub; L. Guerbous

doi:10.4028/www.scientific.net/MSF.609.231

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HomeMaterials Science ForumMaterials Science Forum Vol. 609Properties of Pt-Assisted Electroless Etched...

Properties of Pt-Assisted Electroless Etched Silicon in HF/Na₂S₂O₈ Solution

Abstract:

The paper reports on hydrothermal electroless etching of high resistivity p-type Si(100) at 35°C. A thin layer of platinum (Pt) was deposited onto the silicon surface by evaporation under vacuum (~ 10-6 Torr) prior to immersion in a solution of HF/Na2S2O8. The HF concentration was kept at 22.5 M while the concentration of Na2S2O8 was varied from 0.03 to 0.18 M. The etching time was varied from 15 to 75 min. The morphology and optical properties of the etched layer as a function of oxidant concentration and etching time were investigated using scanning electron microscopy (SEM) and photoluminescence measurements.